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Mark LaPedus The silicon foundry business is expected to see steady growth inbut that growth will come with several challenges. Intel already has encountered some difficulties, as the chip giant recently pushed out the volume ramp of its new 10nm process from the second half of to the first part ofaccording to analysts.
In addition, several foundry vendors are ramping up a new 22nm process, although the demand picture remains uncertain for this technology right now. On top of that, foundry vendors see enormous demand for mm capacity.
Yet mm capacity will remain tight, if not sold out, throughout That includes sensors, processors, image sensors, wireless and analog RF.
But perhaps the most intriguing segment is China, where many foundry vendors are ramping up or building new fabs. In the overall foundry market, TSMC continues to dominate the landscape with a Top 10 foundries by revenue.
Samsung, Powerchip numbers are estimates. TrendForce More numbers Clearly, the signs are positive. Demand is robust for analog, flash memory and logic. In total, IC units are projected to grow 7.
The IC industry is changing, however. At each node, process cost and complexity are skyrocketing, so now the cadence for a fully scaled node has extended from 18 months to 2.
In addition, fewer foundry customers can afford to move to advanced nodes. As before, though, the mobile phone represents the biggest market for chips. Other markets are growing faster. With those growth drivers in mind, foundry vendors must develop more and different processes to meet the growing requirements from customers.
But only a few foundries have the resources to develop a multitude of technologies. The smaller players are viable, but they must focus on a few select markets. The consolidation translates into a dwindling customer base for foundry vendors.
After years of oversupply, silicon wafer vendors see renewed demand. But vendors have not invested in new plants, and many have raised their prices. Rising demand for chips is causing shortages of select manufacturing capacity, various package types and even some equipment. Samsung also has announced various half-node offerings.
The node names are confusing. Regardless, the node migrations are challenging. In finFETs, the control of the current is accomplished by implementing a gate on each of the three sides of a fin. Lam Research Generally, finFETs solve the short channel effects and other scaling issues, but the technology is more difficult and costly to fabricate.
Intel was supposed to ramp its 10nm finFET process in the second half ofbut the schedule recently slipped. Instead of double patterning, now you are doing self-aligned quad patterning.Siemens suppliers are requested to send the signed declaration to their assigned Siemens contact, alternatively it can be sent to the following address: Siemens AG Global Services - Supply Chain Management.
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